CIRCUIT MODULE AND ITS PRODUCING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a circuit module in which solder fillet of an electronic component can be prevented from melting through reflow to cause short circuit. SOLUTION: The circuit module (1) is provided with a first resin (7) covering from a land electrode on a circuit board (3) to the solder fillet (5) connecting the electronic component (21) on the mounting surface (3a) and interposing between the electronic component (21) and the mounting surface (3a), a second resin (9) covering at least the upper surface of the first resin part (7) and the electronic component (21) connected through the solder fillet (5). The first resin (7) serves to prevent short circuit even if the solder fillet (5) melts through reflow. COPYRIGHT: (C)2004,JPO