| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection device having a contact terminal for contacting a test object at multiple points at high density and to provide its production method. SOLUTION: A hole to be a mold for forming a contact terminal 103 is formed by anisotropic etching of silicon wafer and by using the mold, an insulator film 104 consisting of the contact terminal 103 and polyimide film by using the mold and a conductor 105 for retrieving are formed. In between the insulator film 104 and a wiring board 107, the silicon wafer to be a buffer layer 108 and a board 109 is pinched to be one body and the mold is removed. Then, to an electrode 110a of the wiring board 107, the conductors 105 for retrieving is connected with solder 111. COPYRIGHT: (C)2004,JPO
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