发明名称 ARRANGEMENT CONFIGURATION OF WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide an arrangement configuration of a wiring board which can assure strength of a game board. SOLUTION: A base element 51 is equipped with an illumination part 9 made of colored plastic formed in a hollow body and a general prize opening 10 inserted into an attachment hole formed in the base element and fixed to the base element. The wiring board 54 that is formed so as to meet the shape of the base element 51 and also lap in the outline shape of the base element is arranged to be inserted in a recess 55 formed in the rear face of the base element. Thereby, there is no wiring board 54 behind the rear face of the base element 51, and attachment holes necessary to attach the base element 51 onto a game board are limited only to an attachment hole for a guiding part 16 installed to guide game balls entering the prize opening 10 to the backside of the game board, and an attachment hole for a connector 18 installed for supplying electrical signals to the wiring board 54. Therefore the size of the attachment holes bored in the game board can be largely reduced as compared with before. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004008451(A) 申请公布日期 2004.01.15
申请号 JP20020165643 申请日期 2002.06.06
申请人 HEIWA CORP 发明人 EBARA SHUICHI
分类号 A63F7/02;(IPC1-7):A63F7/02 主分类号 A63F7/02
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