| 摘要 |
A method and apparatus for using a robot for handling and processing of a semiconductor wafer. In particular, the robot is used to transfer wafers from a variety of wafers holding devices to a number of processing locations. After the wafer is placed in position, the robot places the vacuum wand in a temporary parking position and engages a different tool to process the wafer. In subsequent stages, yet another tool is engaged by the same robot to handle the chemistry used in the process.
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