| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device of high manufacturing yield which is effective for application to a semiconductor device of a face-up structure, in particular. <P>SOLUTION: In manufacturing the semiconductor device, a method has a process (a) for preparing a semiconductor chip having an electrode pad on a major surface, a wiring board having an electrode pad on the major surface, and a cap member wherein wiring is fixed, a connecting part at one end side of the wiring is arranged corresponding to the electrode pad of the semiconductor chip, and a connecting part at the other end side of the wiring is arranged corresponding to the electrode pad of the wiring board; a process (b) for fixing the semiconductor chip to the major surface of the wiring board; and a process (c) for connecting the electrode pad of the semiconductor chip and the connecting part at the one end side of the wiring and connecting the electrode pad of the wiring board and the connecting part at the other end side of the wiring with the semiconductor chip fixed to the major surface of the wiring board covered with the cap member. <P>COPYRIGHT: (C)2004,JPO |
