| 摘要 |
PROBLEM TO BE SOLVED: To selectively form a protection film on a front surface of an interconnection line to protect the interconnection line, and to secure a sufficient flatness for an insulation film or the like which is deposited on the front surface of the substrate whereon the protective film is formed, eliminating a process of planarizing the front surface. SOLUTION: An interconnection line material 7 is embedded in a fine recessed portion 4 for interconnection line formed in the front surface of the substrate. After planarizing the front surface of the substrate by removing an unwanted interconnection line material, the interconnection line material 7 is further removed to from a recessed portion 4a to be filled in an upper part of the fine recessed portion 4. Then, a protective film 9 is selective formed inside the recessed portion 4a to be filled. COPYRIGHT: (C)2004,JPO
|
