| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive ceramic substrate having bump electrodes in which finer bump electrodes can be formed as compared with a conventional one. SOLUTION: At least one layer of a first green sheet 210, 220, 230 composed of low temperature fired ceramic material, a second green sheet 12 having a sintering temperature higher than that of the first green sheet and provided with through holes for forming a bump electrodes, and third green sheets 11 and 13 having a high sintering temperature, are prepared. The second green sheet is placed in layer without filling the through hole thereof and arranging the third green sheet on the outside. The multilayer body is then fired while being pressurized and after the first green sheet and conductive paste are sintered, unsintered second and third green sheets are removed. Since the empty through holes of the second green sheet are filled with fluidized ceramic material flowing into the through holes while pushing a conductor layer for electrode formed thereon, bump electrodes 50 having the conductor layer on the surface and composed internally of ceramic are formed while arranging the height. COPYRIGHT: (C)2004,JPO
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