发明名称 ELECTRONIC APPARATUS ATTACHING HEAT SINK
摘要 PROBLEM TO BE SOLVED: To provide an electronic apparatus in which, when water splashes on a part, etc. of an automobile or a motorcycle, the water does not permeate into a part in which heat is required to be dissipated particularly, thereby raising reliability in the part. SOLUTION: In the electronic apparatus, electronic parts which generate heat are adhered and mounted to a base of a metal casing, and a heat sink is attached to the metal case to dissipate the generated heat outward. A part around a contact plane which attaches the heat sink in the metal case and below the electronic parts which generate heat is enclosed with a groove. Specifically, the groove is formed to have a depth of 0.8 mm or more and a width of 1 mm or more. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004014600(A) 申请公布日期 2004.01.15
申请号 JP20020162611 申请日期 2002.06.04
申请人 SHINDENGEN ELECTRIC MFG CO LTD 发明人 HAYASHI YASUHIKO;ITO TAKUYA
分类号 H05K5/02;H01L23/36;H05K5/04;H05K7/20;(IPC1-7):H05K5/02 主分类号 H05K5/02
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