NEW ORGANOSILICON COMPOUND, METHOD FOR PRODUCING THE SAME AND SURFACE TREATING AGENT AND RESIN ADDITIVE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a new organosilicon compound improving adhesion of a metal such as copper, steel and aluminum or an inorganic substance such as silica, aluminum oxide and aluminum hydroxide to a resin and to provide a method for producing the organosilicon compound and a surface treating agent and a resin additive using the compound. SOLUTION: The new organosilicon compound is represented by general formula (1) [wherein, R1is an H or a CH3; R2is represented by formula (2); R3is a 1-20C alkyl group (oxygen, a carbon-carbon double bond, an NH group or a phenyl group may be contained in the chain) or a phenyl group; R4s are each a 1-10C alkyl group (oxygen may be contained in the chain); R5s are each a 1-10C alkyl group; n and m are each as follows; n is an integer of≥1; and m+n is 3]. COPYRIGHT: (C)2004,JPO