发明名称 STRUCTURE AND METHOD FOR SHIELD PROCESSING OF FLAT SHIELDED WIRE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a structure for shield processing of a flat shielded wire which is capable of obtaining stable electrical contact between a grounding wire and a shield covering member. <P>SOLUTION: A flat shielded wire comprises a plurality of shielded center wires 4 having a center wire 2 covered with an insulating inner layer 3; a shield covering member 6 which consists of a foil reinforcement sheet 8 arranged in an inner layer and a conductive metal foil 9 in an outer layer for covering the circumference of the plurality of center wires 4; a flat shielded wires 1 which is covered with an insulating outer cover 7 around the circumference of the shield covering member 6; a pair of resin members 10, 11; and a grounding wire 13. In addition, in a structure and method for shield processing of the flat shielded wire 1, the flat shielded wire and part of the grounding wire are sandwitched between a pair of the resin members 10, 11 at a position between adjacent shield center wires of the flat shielded wire 1; under this condition, as compressing force is being applied between a pair of resin members 10, 11, ultrasonic vibration is applied, thereby both insulating outer cover 7, 13b are melted and splashed to form a contact area between a conductive wire 13a of the grounding wire 13 and the shield covering member 6. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004014389(A) 申请公布日期 2004.01.15
申请号 JP20020168589 申请日期 2002.06.10
申请人 YAZAKI CORP 发明人 IDE TETSUO;MITA AKIRA
分类号 H01R43/02;H01R43/00;H02G1/12;H02G1/14;(IPC1-7):H01R43/02 主分类号 H01R43/02
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