| 摘要 |
PROBLEM TO BE SOLVED: To prevent an insulation property from reducing when a printed wiring board is divided at a cutting section. SOLUTION: The printed wiring board 10 comprises: a plurality of laminated insulating substrates 12; a conductive layer 14 provided on the front surface or rear surface of the insulating substrate 12; and the cutting section 20 that consists of perforated portions 16 and long hole portions 18, which penetrate the insulating substrate 12 in a laminated direction. Further, a distance d1 from the long hole portions 18 to the conductive layer 14 is larger than the distance d2 from the long hole portions 18 to the conductive layer 14. Since the distance d1 from the long hole portions 18 to the conductive layer 14 is larger than the distance d2 from the long hole portions 18 to the conductive layer 14, probability that a crack C having occurred at the perforation portions 16 reaches the conductive layer 14 is low compared with the prior art. COPYRIGHT: (C)2004,JPO
|
