| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that sufficiently lets a heat generated by the semiconductor device escape to the outside without confining it inside and is given appropriate durability against a shock in a vertical direction. SOLUTION: The semiconductor device is provided with a printed wiring board to which a semiconductor package provided with a solder bump as an external connection terminal is mounted, and the semiconductor package is retained and fixed by an x-shaped retaining plate along a diagonal direction thereof, in a direction of the printed wiring board by means of any pressure applying means. The retaining plate is made of a material having high strength. COPYRIGHT: (C)2004,JPO
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