发明名称 COMPOSITION FOR HEAT-CONDUCTIVE ELECTRICALLY INSULATING PRESSURE-SENSITIVE ADHESIVE, AND PRESSURE-SENSITIVE ADHESIVE SHEET USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a composition for a heat-conductive electrically insulating pressure-sensitive adhesive excellent in applicability and storage stability; a heat-conductive electrically insulating pressure-sensitive adhesive excellent in heat conductivity and adhesive properties; and a heat-conductive electrically insulating pressure-sensitive adhesive sheet. SOLUTION: The composition for a heat-conductive electrically insulating pressure-sensitive adhesive, excellent in applicability and storage stability, is prepared by compounding an alkyl (meth)acrylate having a 1-14C alkyl group with a photopolymerization initiator, heat-conductive electrically insulating particles, and a resin having a specific molecular weight and acid value. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004010859(A) 申请公布日期 2004.01.15
申请号 JP20020169925 申请日期 2002.06.11
申请人 DAINIPPON INK & CHEM INC 发明人 IWASAKI TAKESHI;TANABE HIROSUKE;ASHITAKA TETSUO;ADACHI KIMIHIRO
分类号 C09J7/02;C09J4/00;(IPC1-7):C09J4/00 主分类号 C09J7/02
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