发明名称 Heat-treating device
摘要 A thermal processing unit according to the invention includes: a processing furnace; gas-supplying means that supplies a process gas into the processing furnace; heating means that heats an inside of the processing furnace to a predetermined process-temperature; a normal-pressure gas-discharging system for discharging gas from the processing furnace at a predetermined discharging-pressure that is near to an atmospheric pressure; a valve provided in the normal-pressure gas-discharging system, the valve being adjustably caused to open and close, a pressure of the gas through the valve being also adjustable; a pressure sensor that detects a discharging-pressure in the normal-pressure gas-discharging system; and a controller that controls the valve based on the pressure detected by the pressure sensor. In the pressure sensor, a gas-contact surface that may come in contact with the discharged gas is made of a corrosion-resistant material that is not metal. According to the invention, a stable control can be achieved without necessity of introducing atmospheric air or introducing any inert gas. In addition, a structure of the gas-discharging system is simplified, reduction of costs is achieved, there is no concern about corrosion of the pressure sensor even in severe corrosion environment, and a stable process can be achieved at any time.
申请公布号 US2004007186(A1) 申请公布日期 2004.01.15
申请号 US20030399955 申请日期 2003.04.23
申请人 SAITO YUKIMASA 发明人 SAITO YUKIMASA
分类号 F27B5/04;F27B5/16;F27D7/02;F27D7/06;H01L21/00;H01L21/31;(IPC1-7):H01L21/205 主分类号 F27B5/04
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