发明名称 |
Wafer bonding of thinned electronic materials and circuits to high performance substrates |
摘要 |
A method of bonding a wafer to a substrate comprising the steps of: providing a wafer having a front surface and a back surface; attaching the front surface of the wafer to a support; thinning the wafer from the back surface; bonding the back surface of the wafer to a substrate using a thin bonding technique; and removing the support from the front surface of the wafer. A circuit comprising: a substrate; and a wafer; wherein the wafer is at most about 50 microns thick; wherein the wafer has a front surface comprising features; and wherein the wafer has a back surface bonded to the substrate using a thin bonding technique.
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申请公布号 |
US2004009649(A1) |
申请公布日期 |
2004.01.15 |
申请号 |
US20030457692 |
申请日期 |
2003.05.20 |
申请人 |
KUB FRANCIS J.;HOBART KARL D. |
发明人 |
KUB FRANCIS J.;HOBART KARL D. |
分类号 |
H01L21/18;H01L21/68;H01L23/482;(IPC1-7):H01L21/30;H01L21/46 |
主分类号 |
H01L21/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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