| 摘要 |
PROBLEM TO BE SOLVED: To efficiently form a wiring protective film or the like on the surface of a substrate at a low initial cost and a low running cost without requiring a wide installation space. SOLUTION: The system is provided with a load/unload area 10 housing a load/unload unit 18 mounted with the primary conveyance robot 22 having a plurality of hands in dry specifics and a substrate cassette 16 with a substrate housed, a cleaning area 12 housing the second conveyance robot 36 having a plurality of hands in wet specifics and a cleaning unit 26 of performing cleaning for the substrate, and a plating treatment area 14 housing the third conveyance robot 46 having hands of a back face adsorption type, pretreatment units 38 and 40 of performing treatment to plating and an electroless plating treatment unit 42 of performing plating treatment. COPYRIGHT: (C)2004,JPO |
