| 摘要 |
PROBLEM TO BE SOLVED: To uniformly and securely cool multiple electronic components. SOLUTION: A cooling structure of a memory model 1 has front side layered spaces 7a and 7b, rear face side layered spaces 7c and 7d and communicating parts 7c and 7d which are formed between the inner wall of a storage container 5 and a substrate 3 on which a plurality of electronic components 2 are mounted and in which cooling air introduced from an air flow-in port 5a by a blower 4 is circulated. The blower 4 having an impeller 4a and a thin motor 4b, which are arranged on the front side and the rear face side of the substrate 3, introduces cooling air from the air flow-in port 5a. Air is circulated through the front side layered spaces 6a and 6b, the communicating parts 6c and 6d and the rear face side layered spaces 6c and 6d, and it is discharged from an air discharge port 5b. Namely, air is circulated along an air circulation route where the direction of an air flow-in port 5a to front side layered space 6a (6b), to communicating part 6e (6f), to rear face side layered space 6c (6d), and to air exhaust port 5b is set to be a forward direction, and a plurality of the electronic components 2 are cooled. COPYRIGHT: (C)2004,JPO |
