发明名称 Method of removing polymer and apparatus for doing the same
摘要 A method of removing polymer adhered to a sidewall of an etched metal layer formed on a substrate, includes (a) dissolving the polymer by providing chemicals onto a surface of the substrate, and (b) rinsing the chemicals out of the substrate by providing pure water onto a surface of the substrate, wherein at least a part of the step (a) is carried out in oxidation atmosphere.
申请公布号 US2004009669(A1) 申请公布日期 2004.01.15
申请号 US20030615806 申请日期 2003.07.10
申请人 NEC ELECTRONICS CORPORATION 发明人 SONODA HIROYUKI;KAWAGUCHI HIDEHIKO;TANAKA MORIMITSU;OHNO HIROKI
分类号 H01L21/306;B08B3/08;H01L21/00;H01L21/02;H01L21/304;H01L21/3213;(IPC1-7):C23F1/00;B44C1/22;C03C15/00;C03C25/68 主分类号 H01L21/306
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