发明名称 |
Method of removing polymer and apparatus for doing the same |
摘要 |
A method of removing polymer adhered to a sidewall of an etched metal layer formed on a substrate, includes (a) dissolving the polymer by providing chemicals onto a surface of the substrate, and (b) rinsing the chemicals out of the substrate by providing pure water onto a surface of the substrate, wherein at least a part of the step (a) is carried out in oxidation atmosphere.
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申请公布号 |
US2004009669(A1) |
申请公布日期 |
2004.01.15 |
申请号 |
US20030615806 |
申请日期 |
2003.07.10 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
SONODA HIROYUKI;KAWAGUCHI HIDEHIKO;TANAKA MORIMITSU;OHNO HIROKI |
分类号 |
H01L21/306;B08B3/08;H01L21/00;H01L21/02;H01L21/304;H01L21/3213;(IPC1-7):C23F1/00;B44C1/22;C03C15/00;C03C25/68 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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