Vorrichtung an einer Hochspannungsfreileitungsanlage zum Abspannen und Verbinden von teilisolierten elektrischen Freileitungsseilen,申请号CH19670009737-传众专利搜索

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发明名称	Vorrichtung an einer Hochspannungsfreileitungsanlage zum Abspannen und Verbinden von teilisolierten elektrischen Freileitungsseilen
摘要
申请公布号	CH468734(A)	申请公布日期	1969.02.15
申请号	CH19670009737	申请日期	1967.07.08
申请人	LICENTIA PATENT-VERWALTUNGS GMBH	发明人	DERTZ,WALTER;BECKER,WILHELM
分类号	H02G7/20;(IPC1-7):H02G7/04	主分类号	H02G7/20
代理机构		代理人
主权项
地址

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