Method of protecting during transportation the lead pins and guide pins of semiconductor devices

摘要

To provide a semiconductor device that prevents the gel resin sealant from spreading out through the insertion gap between the base of the lead pin block and the inner face of the frame portion. The lead pin block 80 has a base 81 on that the lead pins P1 to P16 are standing; a step 82 for accepting thereon the cover plate; a coupling claw 81a formed on the side face of the base 81 opposed facing to the face on that the step 82 is formed; guide pins G1 and G2 inserted into the guide holes of the female connector for the lead pins P1 to P16; an air vent 83 formed through the base 81 from the recess 82a of the step 82 to the step portion of the coupling claw 81, and a plurality of stopper protrusions 84 formed on the upper face of the base 81. By inserting the block 80 on the side of the inner face of the frame portion 12 and by coupling the coupling claws 12b and 81a with one another, the block 80 is installed tightly on the case frame 10, and the gap G between the block 80 and the frame portion 12 is closed with the sealant 85. The inner space of the case frame 10 communicates to the outside through the air vent 83.