发明名称 |
Plural semiconductor devices bonded onto one face of a single circuit board for subsequent batch resin encapsulation of the plural semiconductor devices in a single cavity formed by molding dies |
摘要 |
The present invention provides a resin-molding method comprising the steps of: placing a circuit base member onto a mounting face of first one of paired dies, wherein a back face of the circuit base member is in contact with the mounting face; placing the paired dies in a closing state for clamping a peripheral region of the circuit base member with the paired dies; and injecting a molten resin into a cavity of the paired dies for filling the cavity with the injected resin, wherein, in the closing state, a first pressure effected to a front face of the circuit base member is set higher in pressure level than a second pressure effected to the back face of the circuit base member, so as to secure the circuit base member to the mounting face. |
申请公布号 |
US6676885(B2) |
申请公布日期 |
2004.01.13 |
申请号 |
US20010781789 |
申请日期 |
2001.02.12 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
SHIMIZU KAZUO;TSURUTA HISAYUKI |
分类号 |
B29C45/14;B29C45/26;H01L21/56;(IPC1-7):B29C45/14;B29C70/70 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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