Solder paste stenciling apparatus for minimizing residue of solder paste

摘要

A solder paste stenciling apparatus for minimizing residue of solder paste includes a stencil having multiple stencil openings defined therein, a supporting member retaining the stencil, and a vibrator for vibrating the stencil. In operation, a substrate is engaged to a bottom surface of the stencil, and solder paste is applied onto a top surface of the stencil so that the stencil openings are filled with the solder paste. The substrate is then slowly separated from the stencil while the vibrator vibrates the stencil to evacuate the solder paste out of the stencil openings and to further deposit on the substrate. Hence, the amount of residual solder paste adhered to inner surfaces defining the stencil openings is minimized.