| 摘要 |
A lead end grid array semiconductor package comprises a leadframe having a plurality of leads. The leads extend outwardly from a chip paddle and have an outer end that defines an outer perimeter of the leadframe. A plurality of inner protrusions and outer protrusions are located on a lower surface of the leads. The outer protrusions communicate with the outer perimeter of the leadframe. An encapsulating material encapsulates the semiconductor chip and the conductive wires to form the semiconductor package. Solder balls are attached to a lower surface of the protrusions. The protrusions on the perimeter of the leadframe enable the semiconductor package to be positioned on a flat heat block when affixing the conductive wires to bond pads in the semiconductor chip. A ball of conductive material is affixed to the lower end of the protrusions to form a ball grid array.
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