| 摘要 |
A spring plate structure for use in a motherboard to contact and support an EMI protective shield is constructed having a bottom bonding wall and a top contact wall, a first sidewall fixedly connected between the bottom bonding wall and the top contact wall at one side, a second sidewall obliquely downwardly extended from the top contact wall opposite to the first sidewall and coupled to an endpiece at one side of the bottom bonding wall by a slip joint.
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