| 摘要 |
A method of preparing a bonded assembly of two substrates at least one of which is transparent or translucent to UV or visible light, comprisesa) applying, to at least one of the substrates, a photo/anaerobic dual cure composition comprising:i) a (meth)acrylate-capped urethane oligomer,ii) at least one (meth)acrylate diluent monomer,iii) an anaerobic curing system, andiv) a free-radical photoinitiator;b) joining the two substratesc) irradiating the adhesive through said transparent or translucent substrates with light of a wavelength effective to activate the photoinitiator for a time sufficient to at least fixture the adhesive, and thend) allowing the assembly to further cure at ambient conditions without for at least 24 hrs without subjecting the fixtured assembly to substantial peel stresses.
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