发明名称 Chemical mechanical polishing
摘要 A planatizing equipment has solid abrasive particles suspended in a liquid suspension. The solid abrasive particles have on their outer surfaces tiny, hard but brittle working edges and points. The liquid suspension medium and the solid abrasive particles have nearly the same density to prevent the brittle working edges and paints from sufficiently contacting and damaging each other. This significantly lengthens the useful life of the solid abrasive particles.
申请公布号 US6676492(B2) 申请公布日期 2004.01.13
申请号 US20020146137 申请日期 2002.05.16
申请人 LI CHOU H. 发明人 LI CHOU H.
分类号 B24B37/04;C09G1/02;(IPC1-7):B24B7/00 主分类号 B24B37/04
代理机构 代理人
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