发明名称 |
Semiconductor integrated circuit device |
摘要 |
A common power source line has first power supply points and second power supply points. The first power supply points are provided for supplying electric power to buffer circuits of low-frequency signal pads, while the second power supply points are provided for buffer circuits of high-frequency signal pads. A wiring distance from a power source pad to the second power supply points as well as a wiring distance from the first power supply points to the second power supply points are set to be relatively long in an overall wiring arrangement on a chip.
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申请公布号 |
US6677781(B2) |
申请公布日期 |
2004.01.13 |
申请号 |
US20020170369 |
申请日期 |
2002.06.14 |
申请人 |
DENSO CORPORATION |
发明人 |
ISHIKAWA YASUYUKI;ICHIKAWA KOUJI;ISHIHARA HIDEAKI |
分类号 |
H01L27/04;H01L21/82;H01L21/822;H01L23/50;H01L23/528;(IPC1-7):H01L25/00 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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