发明名称 Semiconductor integrated circuit device
摘要 A common power source line has first power supply points and second power supply points. The first power supply points are provided for supplying electric power to buffer circuits of low-frequency signal pads, while the second power supply points are provided for buffer circuits of high-frequency signal pads. A wiring distance from a power source pad to the second power supply points as well as a wiring distance from the first power supply points to the second power supply points are set to be relatively long in an overall wiring arrangement on a chip.
申请公布号 US6677781(B2) 申请公布日期 2004.01.13
申请号 US20020170369 申请日期 2002.06.14
申请人 DENSO CORPORATION 发明人 ISHIKAWA YASUYUKI;ICHIKAWA KOUJI;ISHIHARA HIDEAKI
分类号 H01L27/04;H01L21/82;H01L21/822;H01L23/50;H01L23/528;(IPC1-7):H01L25/00 主分类号 H01L27/04
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