| 摘要 |
A method of constructing a multilayer electric apparatus, comprising the steps of first providing a set of dielectric layers and forming a set of conductive features and at least one fiducial marking, in mutual reference to each other, on a first one of the dielectric layers. Next, the dielectric layers are joined together to form a stack, such that the first of the dielectric layers is interposed depthwise between others of the dielectric layers and the at least one fiducial marking is distinctly observable from outside of the stack. Finally, a via is drilled from the exterior of the stack to one of the conductive features of the first dielectric layer, referencing the drilling to the fiducial marking.
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