METHOD FOR ASSEMBLING DOUBLE CHIP SEMICONDUCTOR PACKAGE USING ADHESIVE TAPE

摘要

PURPOSE: A method for assembling a double chip semiconductor package using an adhesive tape is provided to be capable of solving the difficulties of alignment generated when carrying out an attaching process with the second semiconductor chip. CONSTITUTION: An adhesive layer(152) is formed at a chip paddle of a lead frame(150). Then, the first semiconductor chip(154) is attached on the adhesive layer. The second semiconductor chip(164) is attached at the upper portion of the first semiconductor chip. At this time, an adhesive tape(162) is attached at the lower portion of the second semiconductor chip. Preferably, the adhesive layer is made of one selected from a group consisting of liquid epoxy and the adhesive tape. Preferably, the first semiconductor chip is larger than the second semiconductor chip.