发明名称 SEALING APPARATUS FOR SEMICONDUCTOR MANUFACTURING PROCESS
摘要 PURPOSE: A sealing apparatus for a semiconductor manufacturing process is provided to be capable of stably conserving process atmosphere and simultaneously improving the yield of products by using a double pipe structure. CONSTITUTION: A sealing apparatus for a semiconductor manufacturing process, is provided with a process chamber(10) for carrying out corresponding processes while conserving vacuum atmosphere at the inner portion and a connecting part(20) for being connected to the process chamber from the outside. The sealing apparatus further includes the first bellows pipe(30) for connecting the process chamber with the connecting part and the second bellows pipe(40) for connecting the process chamber with the connecting part at the outer portion of the first bellows pipe. At this time, the second bellows pipe has a larger diameter than that of the first bellows pipe.
申请公布号 KR20040003334(A) 申请公布日期 2004.01.13
申请号 KR20020038000 申请日期 2002.07.02
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, JEONG SU
分类号 H01L21/00;(IPC1-7):H01L21/00 主分类号 H01L21/00
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