发明名称 Semiconductor device having ferroelectric film and manufacturing method thereof
摘要 First and second semiconductor regions are formed separately from each other in a semiconductor substrate. A gate electrode is formed above the semiconductor substrate which lies between the first and second semiconductor regions. An interlayer insulating film is formed on the semiconductor substrate to cover the first and second semiconductor regions and the gate electrode. First and second lower electrodes are formed on the interlayer insulating film. A first contact plug is formed in the interlayer insulating film in contact with the first lower electrode. A second contact plug is formed in the interlayer insulating film in contact with the second lower electrode. A first ferroelectric film is formed on the first lower electrode. A first upper electrode is formed on the first ferroelectric film. A second ferroelectric film is formed on the second lower electrode. A second upper electrode is formed on the second ferroelectric film.
申请公布号 US6677630(B1) 申请公布日期 2004.01.13
申请号 US20020178744 申请日期 2002.06.25
申请人 KABUSHIKI KAISHA TOSHIBA;INFINEON TECHNOLOGIES, AG 发明人 KANAYA HIROYUKI;HILLIGER ANDREAS
分类号 H01L27/105;H01L21/8242;H01L21/8246;H01L27/115;(IPC1-7):H01L27/108;H01L29/76;H01L29/94 主分类号 H01L27/105
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