发明名称 Method of fabricating a diode protecting a gate electrode of a field effect transistor
摘要 There is provided a method including the steps of: forming spaced gate patterns on a main surface of a semiconductor substrate; forming sidewall films on the gate patterns, respectively, at their respective sidewalls facing each other; and, with the gate patterns and the sidewall films used as a mask, implanting a dopant in the semiconductor substrate to form a doped region. The doped region and a substrate region adjacent thereto together form a diode protecting a gate electrode of a field effect transistor. The doped region as a constituent of the diode can be minimized in size to be smaller than a limit of resolution.
申请公布号 US6677215(B2) 申请公布日期 2004.01.13
申请号 US20020309022 申请日期 2002.12.04
申请人 RENESAS TECH CORP 发明人 YAMAGUCHI YASUO
分类号 H01L27/04;H01L21/329;H01L21/331;H01L21/822;H01L21/8234;H01L27/02;H01L27/06;H01L27/088;H01L29/861;(IPC1-7):H01L21/331 主分类号 H01L27/04
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