| 发明名称 |
Semiconductor device |
| 摘要 |
The semiconductor device has a flip chip structure. The chip is electrically connected to the chip mounting member via function bumps provided on the chip. Dummy bumps acting against a local bending force of the chip are interposed between the chip and the chip mounting member.
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| 申请公布号 |
US6677677(B2) |
申请公布日期 |
2004.01.13 |
| 申请号 |
US20020106198 |
申请日期 |
2002.03.27 |
| 申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
KIMURA MICHITAKA;IWASAKI TOSHIHIRO;HATANAKA YASUMICHI;WAKAMIYA KEIICHIRO |
| 分类号 |
H01L23/12;H01L21/4763;H01L21/58;H01L21/60;H01L23/00;H01L23/32;H01L23/48;H01L23/50;H01L23/52;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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