发明名称 Fastening arrangement for light emitting diode metal array
摘要 A mounting assembly for at least one array of light emitting diodes (LEDs) comprises at least one metal circuit board and mounting bracket. The circuit board has one or more LEDs attached to it and at least one first engaging opening and at least one second engaging opening formed through the circuit board. The first engaging opening is key shaped with a larger portion and a narrowed elongated portion so that engaging surfaces are formed adjacent opposite edges of the narrowed portion. The mounting bracket is formed of a electrically non-conducting material such as plastic with at least one first engaging tab and at least one second engaging tab formed thereon. The first engaging tab is configured to have a narrow portion and a larger portion connected to the outward end of the narrow portion so that there is a gap formed between the edges of the larger portion and the mounting surface. The larger portion is dimensioned to be able to be passed through the larger portion of the first engaging opening but too large to pass through the elongated narrowed portion of the first engaging opening, and the narrow portion is dimensioned to be able to fit into the elongated narrowed portion of the first engaging opening so that the larger portion of the first tab engages the engaging surfaces when the narrow portion of the first tab is moved into the elongated narrowed portion of the first engaging opening. The second engaging tab is configured and positioned to enter and engage the second engaging opening when the narrow portion of the first tab is moved into the elongated narrowed portion of the first engaging opening to lock the circuit board in position against the mounting bracket.
申请公布号 US6678171(B1) 申请公布日期 2004.01.13
申请号 US20020279284 申请日期 2002.10.24
申请人 GUIDE CORPORATION 发明人 DREWS EDWIN R.;BEELER MICHAEL W.;ROBINSON ERNEST W.
分类号 F21S8/10;F21V19/00;H02B1/01;H05K3/20;(IPC1-7):H02B1/01 主分类号 F21S8/10
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