HEAT-RESISTANT TEMPORARY ADHESIVE

摘要

Provided are a heat-resistant temporary adhesive comprising both a photocurable resin component obtained by mixing the following components (A) and (B) and a photopolymerization initiator component; a laminate composed of a layer of the adhesive and adherends; and a process for recovering adherends from the laminate: (A): a polyalkylene glycol di(meth)acrylate having an average molecular weight of 400 to 1000, and (B): at least one (meth)acrylate selected from the group consisting of the following components (b1) to (b3): (b1): a polyalkylene glycol di(meth)acrylate having an average molecular weight of 200 or above but below 400, (b2): a dipentaerythritol derivative selected from the group consisting of dipentaerythritol (meth)acrylates wherein three to six hydroxyl groups of dipentaerythritol are esterified with (meth)acrylic acid; ϵ-caprolactone-modified dipentaerythritol (meth)acrylates; and alkylated dipentaerythritol acrylates; and (b3): a methacrylate of higher aliphatic alcohol.