| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor laser device in which radiation is improved by making a heat sink part columnar concentric with a base part, forming a groove along with an axial direction of the heat sink part and locating a semiconductor laser element on the bottom of the groove. <P>SOLUTION: In a semiconductor laser device 1 in which a semiconductor laser element 9 is located in a heat sink part 4 of a package 2 composed of a circular base part 3 and the heat sink part 4, the heat sink part 4 is made columnar concentric with the base part 3, a groove 5 is formed in the axial direction of the heat sink part 4, and the semiconductor laser element 9 is located on a bottom portion 6 of the groove 5. In the package portion 2, the radiation is improved by integrally forming the base part 3 and the heat sink part 4 from a metal such as copper. <P>COPYRIGHT: (C)2004,JPO |
