| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder splice and a sealing structure which have high integrity between materials, having different thermal expansion coefficients and connected, even when the materials are exposed to cyclic changes in the temperature. <P>SOLUTION: First and second parts (230 and 250) having different thermal expansion coefficients and solder (240) attached between the first and the second parts (230 and 250) are provided. The solder has a toroidal shape, and has the structure and has a structure which surrounds a cavity (260) formed between the first and the second parts (230 and 250). <P>COPYRIGHT: (C)2004,JPO |
