| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a pressure sensitive adhesive sheet for manufacturing an IC chip, which improves the handling ease of a semiconductor wafer during manufacturing steps of the IC chip, protects the semiconductor wafer by rigidly adhering to the same during application, and facilitates separation thereof after the application, and to provide a method for manufacturing the IC chip. <P>SOLUTION: The pressure sensitive adhesive sheet for manufacturing the IC chip consists of a substrate and a pressure sensitive adhesive layer formed on a single surface of the substrate. The substrate is self-supportable and flexible, and the pressure sensitive adhesive layer contains a gas generating agent which generates a gas upon the application of a stimulus thereto. <P>COPYRIGHT: (C)2004,JPO</p> |
