MILLIWAVE BAND MODULE WITH BUILT-IN SEMICONDUCTOR

摘要

PROBLEM TO BE SOLVED: To provide a milliwave band module with a built-in semiconductor in which the heat from a semiconductor device operating in a milliwave band is efficiently dissipated so that the semiconductor devices and circuit components are mounted in high density. SOLUTION: The module comprises an electric insulating substrate (105) composed of a mixture containing an inorganic filler and thermo-setting resin; a high heat-conductive substrate (103) of a dielectric material of high heat conductivity which is laminated on one surface of the electric insulating substrate (105); a plurality of wiring patterns (119) formed on both substrates, a semiconductor device (101) which is disposed inside the electric insulating substrate (105), mounted in face-up to the high heat-conductive substrate (103), and electrically connected to the wiring pattern (119) for operation in a milliwave band; and a distribution constant circuit element (121) and active element (124) provided on it. A void (107) is provided in the interior of the electric insulating substrate (105), and in the exterior of the surface of the distribution constant circuit element (121) and the active element (124). COPYRIGHT: (C)2004,JPO