发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which can be developed by an aqueous alkaline solution, has a high sensitivity, and permits easy formation of patterned thin films excelling in various properties, such as planarity, high resolution, developability, heat resistance, chemical resistance, adhesion properties to substrates, transparency, and insulation properties, or permits the easy formation of the patterned thin-films having excellent dielectric properties together with the various properties described above and a pattern forming method using the same. <P>SOLUTION: The positive photosensitive resin composition includes at least an alkaline soluble resin consisting of a copolymer having at least styrenes or benzyl (meth)acrylate, acrylic acid or methacrylic acid, and hydroxy alkyl ester as constitutional units, 1,2-naphthoquinone azido group containing compound, and a bridge agent. In the pattern forming method, light intensity applied in the second exposure is 1-15 times of that of a first exposure in performing the processes of spreading, the first exposure, development, the second exposure, and heat treatment one by one for the positive photosensitive resin composition. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004004233(A) 申请公布日期 2004.01.08
申请号 JP20020158919 申请日期 2002.05.31
申请人 FUJIFILM ARCH CO LTD 发明人 TAKAGI YOSHIHIRO
分类号 G03F7/022;G03F7/004;G03F7/033;G03F7/40;H01L21/027 主分类号 G03F7/022
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