| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer circuit board incorporating inductor elements, capacitors and resistive elements which improve permeability of coils and cores, adhesive property with a base material and a degree of freedom in design of the multilayer circuit board and further to provide its fabricating method. <P>SOLUTION: First interconnection layers 21a and 21b as well as an insulation layer 31 are formed in both sides of an insulation substrate 11. A lower electrode 41a for the capacitors, a lower coil interconnection 41b for the inductors and an insulation layer 51 are formed in one side of the insulation layer 31. A dielectric layer 61 and a sintered magnetic material pattern layer 71 are formed in the insulation layer 31 on the lower electrode 41a for the capacitors and in the insulation layer 51 on the lower coil interconnection 41b for the inductors, respectively. Further, an upper electrode 84a for the capacitors and an upper coil interconnection layer 84b for the inductors are formed and then resistive elements 91 are formed between the upper electrode 84a for the capacitors and a third interconnection layer 84c. As a result, the multilayer circuit board 100 is obtained which is formed with the inductors, the capacitors and the resistive elements. <P>COPYRIGHT: (C)2004,JPO</p> |
