发明名称 SUBSTRATE LAMINATING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a substrate laminating device which prevents air bubbles from being included into between substrates and precisely positions the substrate inside a vacuum chamber and ensures the secure lamination of the substrates. <P>SOLUTION: This substrate laminating device performs the steps to place a lower substrate LB with a applied adhesive on a lower stage 4 and close a vacuum chamber 3 formed between an upper casing 2 and a lower casing l by lowering the upper casing 2 under a state that an upper substrate UB with an applied adhesive is grasped by an upper chuck l0 and further, positions the lower substrate LB by pressing the four sides of the lower substrate LB by means of a pressing rod 7a. In addition, the device removes the lower substrate LB from its set position after drawing a vacuum from the vacuum chamber 3 by actuating a vacuum source and makes the lower stage 4 ascend and presses both substrates LB and UB against an upper stage 9 following the sequential steps of removing the upper substrate UB from its set position by rotating the upper chuck l0 and dropping the upper substrate UB under guidance by a guide member 9a. Thus the substrate laminating operation is achieved. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004001321(A) 申请公布日期 2004.01.08
申请号 JP20020160825 申请日期 2002.05.31
申请人 SHIBAURA MECHATRONICS CORP 发明人 FUSE KENTEI
分类号 G02F1/13;B32B37/00;B65G49/06;G02F1/1339;H01L21/677;H01L21/68;(IPC1-7):B32B31/14;G02F1/133 主分类号 G02F1/13
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