| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a light emitting diode for manufacturing a light emitting diode having a desired mechanical property and translucency and of minimizing the resistivity at the interface between the transparent layer and the growth layer. <P>SOLUTION: A light emitting diode is manufactured in such a way that after a light emitting diode structure 40 of a relatively thin film is formed by growing light emitting diode layers 32, 34, 36 and 38 sequentially one another on a temporary growth substrate, the temporary growth substrate is removed and instead a conductive, translucent substrate 42 is bonded by means of the wafer-bonding technique to the light emitting diode layer 32 in the position of the temporary growth substrate. <P>COPYRIGHT: (C)2004,JPO |
