发明名称 |
Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formed |
摘要 |
An IC chip/substrate assembly bonded together by a non-conductive adhesive and a method for forming the assembly. The assembly consists of an IC chip that has bumps formed on an active surface, a substrate that has bond pads formed on a top surface, wherein at least one of the IC chip and the substrate has dummy bumps formed in-between the bumps or the bond pads, and a non-conductive adhesive disposed in between and bonding the IC chip and the substrate together in a face-to-face relationship with the bumps in electrical communication with the bond pads.
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申请公布号 |
US2004004292(A1) |
申请公布日期 |
2004.01.08 |
申请号 |
US20020190276 |
申请日期 |
2002.07.05 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
HSIEH YU-TE;CHANG SHYH-MING;LIN WEN-TI |
分类号 |
H01L21/56;H05K1/02;H05K3/30;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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