Method for waterproofing power circuit section and power module

摘要

A power circuit section including electronic parts of a plurality of FETs and relays having leg terminals is arranged in a circuit arrangement region on a heat radiating member. A surrounding wall member having a seal member at a lower end face thereof and capable of surrounding the power circuit section 1 including the leg terminals of the electronic parts is attached to surround the circuit arrangement region in a state of bringing a seal member into close contact with a circuit arrangement surface. After a circuit arranging step and a surrounding wall forming step, a waterproofing resin in a liquid state is poured into a space surrounded by the surrounding wall member until at least the leg terminals of the electronic parts are sealed. The waterproof resin is cured to form a waterproofing layer for sealing the electronic parts.