System and method to improve IC fabrication through selective fusing

摘要

A system and methodology for fabricating integrated circuits (ICs) on wafer die monitors at a subset of die one or more parameters that can affect the performance capabilities of associated ICs. One or more respective parameters for unmeasured die are derived based on one or more of the measured parameter. Fuses are selectively set for ICs at each die location based on parameters associated with each respective die location, thereby configuring the respective ICs accordingly.