| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the size of a semiconductor device, to increase the operational speed, to enhance the electrical reliability, and to increase the mounting accuracy. <P>SOLUTION: In a pellet placement region on the main face of a base substrate 1, a semiconductor pellet 2 is placed. A first electrode pad 1B positioned on the backside of the base substrate 1 is electrically connected to an external terminal 2A positioned on the main face of the semiconductor pellet 2. A rigid substrate is used as the base substrate 1, and the first electrode pad 1B of the base substrate 1 is electrically connected to a second electrode pad 1A. In the pellet placement region on the main face of the base substrate 1, the semiconductor pellet 2 is placed with its main face turned down. The external terminal 2A of the semiconductor pellet 2 and the second electrode pad 1A are electrically connected with a bonding wire 6 which is passed through a slit 5 in the base substrate 1. <P>COPYRIGHT: (C)2004,JPO |
