发明名称 |
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, ELECTRONIC COMPONENT AND SURFACE ACOUSTIC WAVE FILTER |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component having an electrode film consisting ofαphase tungsten whose resistivity is small, film hardness is high and warp is little without the need of a special apparatus and without the need of expensive gas. <P>SOLUTION: The method for manufacturing the electronic component comprises an electrode film forming process for forming the electrode film consisting of theαphase tungsten on a substrate at the substrate temperature of 100-300°C by a sputtering method; a process for working the electrode film into a desired shape; and a process for heat-treating the electrode film. <P>COPYRIGHT: (C)2004,JPO</p> |
申请公布号 |
JP2004006673(A) |
申请公布日期 |
2004.01.08 |
申请号 |
JP20030048147 |
申请日期 |
2003.02.25 |
申请人 |
MURATA MFG CO LTD |
发明人 |
TAKADA HIDEKAZU;YAMAMOTO KOJI;KANTANI GENJI;KADOTA MICHIO |
分类号 |
C23C14/14;C23C14/34;H01L21/3205;H01L21/768;H01L41/09;H01L41/22;H01L41/29;H03H3/08;H03H9/64 |
主分类号 |
C23C14/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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