发明名称 METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, ELECTRONIC COMPONENT AND SURFACE ACOUSTIC WAVE FILTER
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component having an electrode film consisting ofαphase tungsten whose resistivity is small, film hardness is high and warp is little without the need of a special apparatus and without the need of expensive gas. <P>SOLUTION: The method for manufacturing the electronic component comprises an electrode film forming process for forming the electrode film consisting of theαphase tungsten on a substrate at the substrate temperature of 100-300°C by a sputtering method; a process for working the electrode film into a desired shape; and a process for heat-treating the electrode film. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004006673(A) 申请公布日期 2004.01.08
申请号 JP20030048147 申请日期 2003.02.25
申请人 MURATA MFG CO LTD 发明人 TAKADA HIDEKAZU;YAMAMOTO KOJI;KANTANI GENJI;KADOTA MICHIO
分类号 C23C14/14;C23C14/34;H01L21/3205;H01L21/768;H01L41/09;H01L41/22;H01L41/29;H03H3/08;H03H9/64 主分类号 C23C14/14
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