| 摘要 |
<P>PROBLEM TO BE SOLVED: To connect an electrode of a light emitting element of a flip-chip type with a lead electrode (external electrode) mechanically, electrically and stably by using a solder easy to form a bump. <P>SOLUTION: The uppermost layer of a part of the electrode exposed from an insulating layer coating a surface of the light emitting element is formed of at least one kind of metal selected out of Ni, Cu, Ag, Fe and Mo which metal is easy to form alloy with solder, or alloy of the metals. <P>COPYRIGHT: (C)2004,JPO |
