| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To perform multiple reflow processing while enhancing productivity. <P>SOLUTION: Any one of heat blocks 71a-71c, 72a-72c, 73a-73c, 74a-74c, or cooling blocks 75a-75c is matched to the product pitch of a circuit board 51 by moving a reflow furnace 61 along the carrying direction of a tape substrate 50 and securing it at a position matching the product pitch of the circuit board 51. Since a thermal processing time is not required to be set for each circuit board 51 having a different product pitch, the tape substrate 50 connecting the circuit boards 51 having a different product pitch can be subjected to reflow processing continuously. <P>COPYRIGHT: (C)2004,JPO</p> |
